Product Description
C70200 CuNi2.2
The copper nickel alloy is the low resistivity alloy used at temperature range up to 300°C (570°F). The alloy is mainly used in heating cables in electric pillows and blankets. The medium resistivity and low temperature coefficient of resistance also make these alloys ideal for control resistors and thermocouples.
| Chemical Composition: |
| | Ni % | Cu % |
| Nominal composition | 2.2 | Bal. |
| Mechanical properties: |
| Wire size | Yield strength | Tensile strength | Elongation |
| Ø | Rp0.2 | Rm | A |
| Mm | MPa | MPa | % |
| 1 | 100 | 240 | 30 |
| |
| Physical Properties: |
| Density g/cm3 | 8.9 |
| Electrical resistivity at 20°C O mm2/m | 0.05 |
| |
| Temperature factor of resistivity: |
| Temperature°C | 20 | 100 | 200 | 300 |
| Ct | 1 | 1.11 | 1.25 | 1.4 |
| |
| Coefficient of thermal expansion: |
| Temperature°C | Thermal Expansion x10-6/K |
| 20 - 100 | 16.5 |
| |
| Thermal conductivity: |
| Temperature°C | 20 |
| W m-1 K-1 | 130 |
| |
| Specific Heat Capacity: |
| Temperature°C | 20 |
| kJ kg-1 K-1 | 0.38 |
| Melting point °C | 1090 |
| Max continuous operating temperature in air °C | 300 |
| Magnetic properties | The material is non-magnetic |
Precision Engineering for ElectronicsC70200 CuNi2.2 copper nickel alloy is crafted with exceptional uniformity, making it ideal for intricate electronic components, connectors, and switch assemblies. Its combination of high tensile strength and superior elongation allows for precision fabrication and reliable performance, especially where durability and consistent conductivity are critical.
Adaptable and Durable Copper Nickel Sheets and StripsAvailable in strips or sheets with polished, smooth surfaces, C70200 CuNi2.2 provides manufacturers flexibility in addressing custom requirements. Its robust physical and mechanical properties, including high strength and resistance to wear, support its utility in demanding electronic applications and ensure long-lasting component life.
Supplied by Trusted Indian Manufacturers and ExportersDistributors, exporters, and suppliers in India provide C70200 CuNi2.2 in various shapes and dimensions. With a focus on quality assurance and adherence to international packaging standards, these suppliers offer comprehensive service and support for all your copper nickel alloy needs.
FAQs of C70200 CuNi2.2:
Q: How is C70200 CuNi2.2 typically used in electronic applications?
A: C70200 CuNi2.2 is widely employed in the production of electronic components, connectors, and switch parts due to its excellent strength, reliable electrical conductivity (about 6% IACS), and high corrosion resistance. Its stable mechanical properties make it particularly suited for applications requiring durability and precise performance.
Q: What benefits does C70200 CuNi2.2 offer compared to standard copper alloys?
A: This copper nickel alloy provides greater resistance to corrosion and wear, enhanced mechanical strength (tensile strength 300550 MPa), and superior elongation (>35% annealed) compared to standard copper grades. These advantages make it ideal for demanding electronic and electrical engineering environments.
Q: Where can I source C70200 CuNi2.2 in India?
A: C70200 CuNi2.2 is distributed, exported, and supplied by a range of reputable manufacturers, exporters, and traders in India, who provide standard or custom sizes, polished finish, and secure export packaging tailored to your specific specifications.
Q: What is the process for ordering C70200 CuNi2.2 strips or sheets?
A: To order, you can approach authorized distributors or manufacturers who will assist you in specifying dimensions such as length, width, thickness, and surface treatment. The material can be custom-fabricated and packed in accordance with standard export procedures to ensure safe delivery.
Q: What surface treatments and finishes are available for this alloy?
A: C70200 CuNi2.2 is commonly supplied with a polished surface and a smooth finish, providing not only aesthetic appeal but also improved resistance to environmental factors. The finish promotes optimal conductivity and minimizes surface defects, essential for electronic component performance.
Q: How does the thermal expansion of C70200 CuNi2.2 benefit its applications?
A: The moderate thermal expansion rate (~17.1 x 10/K) ensures dimensional stability when the material is subjected to temperature fluctuations, which is particularly beneficial in electronic assemblies where thermal consistency is paramount.